Vision: To become the global leader in intelligent perception

Mission: To achieve a new world of human-machine integration

Fortsense
Dedicated to the development of core LiDAR chips and diverse machine vision solutions, Fortsense Technology was the first in the industry to release and mass-produce array-based SPAD LiDAR receiver chips and integrated solutions.

Fortsense is recognized as a National ""Little Giant"" Enterprise for Specialized and Sophisticated Technology, a National High-Tech Enterprise, and the first-prize recipient (second-class) of the Guangdong Science and Technology Progress Award. The company also operates the Guangdong Engineering Research Center for Human-Machine Interaction Sensors and is a certified Shenzhen Postdoctoral Practice Base.

With over 200 employees, Fortsense's team includes more than 150 R&D professionals, featuring one Shenzhen municipal-level leading talent, multiple recipients of the Shenzhen Peacock Plan for Overseas High-Level Talents, and two Nanshan District Pilot Talents. The company has filed over 900 intellectual property applications, with more than 500 patents granted.

Fortsense has established strategic partnerships with major LiDAR solution providers, actively driving the adoption of automotive-grade solid-state LiDAR and delivering industrial-grade LiDAR products to market. In the smart door lock sector, FUSHI holds a market-leading position in 3D facial recognition chips, with a market share exceeding 40%.
  • Core Chip Design and Algorithm Capabilities
  • Intellectual Property Layout
Lianghua Mo

Company Founder and Chairman


Bachelor's degree in Microelectronics from Nanjing University, Master's degree in Integrated Circuits from Hong Kong University of Science and Technology,Ph.D. Candidate at Tsinghua University's School of Integrated Circuits,EMBA from Cheung Kong Graduate School of Business, Adjunct Master's Supervisor at Huazhong University of Science and Technology.


Primary Recipient of the Second Prize of Guangdong Provincial Science and Technology Progress Award, Director of Guangdong Human-Computer Interaction Sensor Engineering Technology Research Center, Shenzhen Local-Level Leading Talent, Annual Innovator of China IC Achievement Award, one of the drafters of the National Standard "Biometric Recognition Anti-counterfeiting Technology Requirements", EO Auto "2023 China Technology Travel Industry Scientific Entrepreneur TOP10」。


With over 20 years of experience in integrated circuit design, he is a leader in domestic analog circuit design, mixed-signal chip design, chip architecture design, and system design. He successfully led the team in the R&D and mass production of LiDAR core chips and various machine vision solutions.

Development history
  • 2017
    2017 The company was registered and established
  • 2018
    2018 Released 3D structured light
  • 2019
    In 2019, the research institute was established and talents from Shenzhen Peacock were introduced.
    Start research on SPAD for LiDAR
    Mass production of 3D structured light face recognition smart lock
  • 2020
    2020 3D structured light face recognition module door lock industry shipments ranked first
    SPAD process is stable
  • 2021
    SPAD will be put into production in 2021&Customer verification
    3D binocular face recognition module shipments ranked first in the door lock industry
    The industry's first mass-produced under-screen color temperature detection product
  • 2022
    The first domestic company to receive a customized order from an automotive LiDAR manufacturer in 2022
    Automotive-grade SiPM mass delivery
    AEC-Q102 automotive certification
    Mass production of automotive-grade single-line SPAD
    Automotive-grade SPAD array goes into production
    3D binocular face recognition module continues to rank first in the door lock industry
  • 2023
    Large array SPAD chips released in 2023, and customer prototypes was available
    Mass production, delivery and iteration of SPAD full range of products
    3D sensing products maintain the leading position in the industry
    3D face ID + palm vein products shipped
  • 2024
    Larege Array SPAD chips are mass-produced in the fields of intelligent lawn mowing robots and unmanned vehicles, and are tested in passenger cars.
    Iterative development of single-line and area array SPADs
    3D face ID product ranks first in market share for 4 consecutive years
Company Honors丨Industry Recognition and Public Recognition
  • In 2019, it won the title of China's most investment-worthy emerging unicorn in 2019
  • On June 16, 2019, it established a joint laboratory for artificial intelligence and machine vision technology with Huazhong University of Science and Technology
  • "In 2020, it became the drafting unit of the national standard "Technical Requirements for Biometric Identification and Anti-counterfeiting""
  • On September 6, 2020, it won the first prize in the 2020 China Smart Sensor Innovation and Entrepreneurship Competition
  • On December 11, 2020, it was recognized as a national high-tech enterprise.
  • December 20, 2020, it won the runner-up in the final of the first "Lixing Cup" Global Alumni Innovation and Entrepreneurship Competition of Nanjing University.
  • On May 28, 2021, it won the 2020 Best Biometric Chip Design Award of the Shenzhen Integrated Circuit Industry Association.
  • In 2021, Shenzhen Semiconductor Industry Association member unit
  • On August 20, 2021, Guangdong Human-Machine Interaction Sensor Engineering Technology Research Center
  • On August 30, 2021, won the first prize in the Pingshan Preliminary Competition of the 13th China Shenzhen Innovation and Entrepreneurship Competition and the 2021 Pingshan District Innovation and Entrepreneurship Competition
  • On October 29, 2021, won the third prize in the industry finals of the 13th China Shenzhen Innovation and Entrepreneurship Competition
  • On November 3, 2021, it won the Global Electronics Achievement Award - Outstanding New Company of the Year
  • In December 2021, it won the Shenzhen Camera Industry Association Chaodian Excellence Award
  • On January 6, 2022, it won the second prize in the Technology Innovation Competition of the Second Tsinghua University Guoqiang Research Institute Cup Global Artificial Intelligence and Robotics Double Innovation Competition
  • In January 2022, it was named TOP1 of the 2021 Shenzhen, Hong Kong and Macao Science and Technology Innovation Top 100
  • In December 2021, it won the Outstanding Enterprise Award in the Growth Group of the 10th China Innovation and Entrepreneurship Competition
  • On March 4, 2022, it won the Zhitu Award-Annual Automotive LiDAR Advanced Technology Award
  • On May 15, 2022, it won the first prize in the Shenzhen Station Finals of the Second Nanjing University "Lixing Cup" Global Alumni Innovation and Entrepreneurship Competition
  • On June 23, 2022, it obtained the Intellectual Property Standardization System Certification
  • On July 6, 2022, it became a member unit of the Low-Speed Unmanned Driving Industry Alliance
  • On August 1, 2022, it became a member unit of the Shenzhen Integrated Circuit Industry Association.
  • On August 23, 2022, it won the second prize in the first integrated circuit "Taihu Core" Entrepreneurship Competition.
  • On November 26, 2022, it won the first prize in the Nanjing finals of the second Nanjing University "Lixing Cup" Global Alumni Innovation and Entrepreneurship Competition.
  • In January 2023, it was approved to establish the Shenzhen Nanshan District Innovative Talent Training Base.
  • February 2023, it was approved to establish the Shenzhen Postdoctoral Innovation Practice Base.
  • On February 5, 2023, the first unit to complete the second prize of Guangdong Provincial Science and Technology Progress Award
  • On March 15, 2023, it was recognized as a Shenzhen-based specialized and innovative small and medium-sized enterprise
  • On March 23, 2023, it won the first prize in the "Rongpiao Cup" High-level Talent Innovation and Entrepreneurship Competition for the Electronic Information Industry Circle Building and Chain Strengthening Special Competition
  • On May 31, 2023, it was named a potential technology unicorn enterprise in Shenzhen in 2022
  • On June 25, 2023, the intellectual property standardization system was certified.
  • In July 2023, it was recognized as a national "specialized, refined and innovative" small giant enterprise.
  • On November 28, 2023, it was listed as the WISE2023 King of Future Business-Annual Enterprise in the Advanced Manufacturing Field.
  • On November 30, 2023, it was listed as "Top 10 Most Valuable Companies in China's Smart Electric Vehicle
  • On December 13, 2023, it was awarded the Cailianshe Science and Technology Innovation Company.
Shenzhen Liu Zhou Hong Kong Shanghai Suzhou Chendu
  • We are inShenzhen
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  • We are inLiuzhou
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  • We are inHong Kong
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  • We are inShanghai
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  • We are inSuzhou
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  • We are inChengdu
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  • Headquarters
    Shenzhen International Innovation Valley
    Integrated Circuit Professional Park
  • Liuzhou
     
  • Hong Kong
     
  • Shanghai
     
  • Suzhou
     
  • Chengdu
     
Future Direction

Never Stop Improving: Upholding a customer-first spirit, integrating their needs into product design, and closely tracking market changes.

Fortsense Co, Ltd

  • Tel:0755-26907704
  • Email:public@fortsense.com
  • Address:Floor 44, Block A, Building 8, Shenzhen International Innovation Valley, Xili Street, Nanshan District, Shenzhen

All rights reserved © Copyright 2021Fortsense Co., Ltd.

Registration number:粤ICP备18121726号甘公网安备 62110202000092号

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Algorithm development capability

The self-developed feature recognition and matching algorithms and deep learning algorithms are widely used in a variety of biometric sensors and are mass-produced by first-tier manufacturers such asHuawei and Samsung.

Sensor chip design capability

The team ranks in the top 10% in the field of domestic chip design.The team has successfully designed a number of world-leading human-computer interaction sensor chips, including touch, capacitive fingerprint, optical fingerprint, and 3D camera chips. The cumulative shipments of the team-led chips have exceeded3 billion pieces .

Optical design capability

The industry-leading optical design team has many years of development experience in machine vision fields,such as 3D imaging and 3D printing, complete optical design, simulation and laboratory environment

Edge computing chip design capability

Independently developed edge computing chips,Integrates multiple hardware modules such as CPU, ISP, DSP, CNN, etc. to empower sensors and provide real-time, efficient and accurate intelligent computing and analysis

Supporting chip design capability

We have many years of design experience in MCU microprocessors, PMU/LDO power modules and other supporting chips, Expert at providing complete system-level solutions